abstract |
Provided is a copper foil with a carrier having good fine circuit formability. A copper foil with a carrier comprising a carrier, an intermediate layer, and an ultrathin copper layer in this order, and conforms to ISO 25178 measured by a laser microscope on the surface of the copper foil with a carrier on the side of the ultrathin copper layer. The ratio of Sp / Spk between the maximum peak height Sp and the protruding peak height Spk is 3.271 to 10.3939. [Selection] Figure 4 |