Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a226364af8a0915073444b8208024e2d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
filingDate |
2019-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_067d881b46424970c3e24310f66275d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1614bcd5fb2176474ccebdfe3d07a553 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbb8155af090465db76438f5ffe88250 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f32d704eafea45b38fd7ed11ef01a4f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8272362be8a4d4c5f78722dac8a16a44 |
publicationDate |
2019-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2019174637-A1 |
titleOfInvention |
Method of manufacturing a polymer printed circuit board |
abstract |
A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11102891-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10561025-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018199441-A1 |
priorityDate |
2017-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |