| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_91343b41ae1c66c6c0361b3c45c98108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d0d122d4b29f9aee0be49958d2294c8a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate |
2019-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdc35f81852548efd70e40a22e3b5d9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05437901bd76c7845911dce4144d8ab7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23b8c85fe5d3333ffcff6483cff0e8ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f0215018b0a1e494535fb4ed183e098 |
| publicationDate |
2020-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-111491458-A |
| titleOfInvention |
Circuit board and method of making the same |
| abstract |
The present invention provides a method for manufacturing a circuit board, which includes the following steps: (1) providing a substrate, and opening holes on the substrate to form through holes; (2) filling the through holes with conductors; (3) providing a a cover layer covering one side of the substrate, the cover layer containing a laser direct structuring additive; (4) providing a separable film and attaching it to the cover layer; (5) by laser Etching to form grooves and through holes on the separable film and the cover layer, and the through holes expose the conductors; (6) electroless plating or electroplating to form circuit patterns in the grooves and through holes (7) repeating steps (1) to (6) at least once; and (8) pressing at least two of the circuit boards unit. The invention also provides a circuit board. |
| priorityDate |
2019-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |