| abstract |
The present invention is an electrolytic copper for flexible PCB which is added to the electrolyte to form an electrolytic copper plating film having a low surface roughness while minimizing the residual stress when electrolytic copper plating of a flexible PCB disc requiring low stress, low roughness, low defects It is an object to provide a plating additive.n n n To this end, in the additive to be added to the electrolyte when forming a copper plating film on the flexible PCB disc, the electrolytic copper plating additive for flexible PCB according to the present invention is chlorine ions, polyethylene-based polyethylene glycol as a surfactant, sulfur as a polishing agent It contains 3-N, N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid which is a containing compound, and Janusgreen B which is a nitrogen containing compound as a leveler. |