| abstract |
The invention discloses a method for preparing a printed circuit board of an ultra-thin metal layer, which uses a basic aliphatic amine gas and a nitrogen gas bubbled by a copper sulfate solution to perform a vacuum capacitive coupling discharge to generate a low temperature plasma. The imide film and the glass fiber cloth coated epoxy resin sheet are subjected to etching and surface treatment of the graft reactive group to increase surface roughness and chemical activity, and then directly subjected to sputtering or electroless copper plating, and then electroplating is performed. Thick to the required copper film thickness. The method of the present invention not only does not require an adhesive (no glue), but also has high peel strength, and can realize production of soft and hard printed wiring boards, multilayer boards, and soft and hard composite boards of ultra-thin metal layers. |