| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0716
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2020-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a846d7d26a553f91dd15f6350ab9a1bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e473552dad0107eaac6e5cb33fe74efd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8f7856b4f6ea56dbe80176e9cc5b6d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef21e5f54081a5a38c94bc98574f59a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59e97413c014deb6bcdfea4a56b95016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_682babf118f793d63f10210fd572d99f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a418099914dc0619164ab9cba210798
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3e8daf75a303d904cfc44187867945d |
| publicationDate |
2021-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021032775-A1 |
| titleOfInvention |
Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board |
| abstract |
The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of: a) providing a multi-layer substrate comprising (i) an insulating core layer having a peripheral surface, or (i') a stack assembly comprising an insulating core layer embedded between two electrically conductive interlayers and at least one outer insulating layer attached on the electrically conductive interlayers and having a peripheral surface, (ii) an optional cover layer covering the peripheral surface, and (iii) at least one through-hole extending through all layers of the multilayer substrate; and a grate structure having multiple slots extending through the optional cover laver and partially extending in the insulating core layer or extending through at least the optional cover layer and at least one of the outer insulating layers; b) forming a non-copper conductive layer or a copper layer on the cover layer and on an inner surface of the through-hole, respectively on an inner surface of the grate structure; c) forming a patterned masking film on the non-copper conductive layer or on the copper layer; d) electrodepositing a copper inner-seal inside the through-hole sufficient to form two blind-microvias, respectively electrodepositing a copper inlay on the non-copper conductive layer or on the copper layer of the inner surface of the grate structure and on the remaining peripheral surface of the non-copper conductive layer or of the copper layer, in one step; e) removing the masking film; and f) electrodepositing a copper filling in the blind-microvias, respectively the copper inlay, and on the first copper layer in one step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102021209537-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114401584-A |
| priorityDate |
2019-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |