| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c048b14af83f2b2abe9f16c449602994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3351b7b52d8a987faa7cfc14e543c1a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-428
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2016-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_383902b8ea1578c5328fa2cc10d088b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_038be28ffc5423964985ffa9af109cd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_267ff85da482d9dfb5ff164336a81c22 |
| publicationDate |
2017-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017193487-A1 |
| titleOfInvention |
Method for preparing printed circuit board of ultra-thin metal layer |
| abstract |
Provided is a method for preparing a printed circuit board of an ultra-thin metal layer. The method utilizes an alkaline fatty amine gas together with nitrogen bubbled through a copper sulfate solution to perform capacitively coupled discharging in a vacuum to generate a low temperature plasma; surface treatments of etching and active group grafting are performed on an epoxy resin board coated with a polyimide film and a glass fiber fabric, so as to increase surface roughness and chemical activity of the epoxy resin board; sputtering deposition or chemical copper plating is directly performed; and electroplating is performed to thicken a copper film to a required thickness. The method does not require an adhesive and has high peel strength, and can be used to realize the fabrication of a flexible printed circuit board, rigid printed circuit board, multi-layer board and rigid-flex board of an ultra-thin metal layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114501862-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114501862-B |
| priorityDate |
2016-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |