| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0588
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2016-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106470525-B |
| titleOfInvention |
Printed circuit board and method of manufacturing the same |
| abstract |
A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: an insulating layer; and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes: a first portion formed on the insulating layer and including an upper corner portion having a predetermined curvature; and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion. |
| priorityDate |
2015-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |