| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d66236d63b7148c1f59e57e25b535357 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 |
| filingDate |
1984-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc9138425b36d77505f7201d3e3090fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6f992428e5085ac264152a5c1595dfe |
| publicationDate |
1984-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0124452-A1 |
| titleOfInvention |
Process for metallising electrically insulating pliable films, and products obtained |
| abstract |
Process for the metallization of flexible polymeric films by reduction of cuprous oxide contained in the film.n n n Metallized films can be used as a basis for manufacturing printed circuits. |
| priorityDate |
1983-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |