http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016117575-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0116 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2016-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2016117575-A1 |
| titleOfInvention | Printed wiring board substrate, printed wiring board, and printed wiring board manufacturing method |
| abstract | An object of the present invention is to provide a substrate for a printed wiring board that has a high peel strength between a base film and a metal layer and can be manufactured at low cost. A printed wiring board substrate according to an embodiment of the present invention includes a base film having insulating properties, and a sintered layer of a plurality of metal particles laminated on at least one surface of the base film. The porosity of a region within 500 nm from the interface with the base film in the sintered layer is 1% or more and 50% or less. A method for producing a printed wiring board substrate according to another embodiment of the present invention includes a step of coating an ink containing metal particles on one surface of an insulating base film, and a step of forming the coating step. A step of sintering the coating film of the ink to be formed, and in the sintering step or the subsequent step, a void in an area within 500 nm from the interface with the base film in the sintered layer formed by sintering the coating film The rate is adjusted to 1% to 50%. |
| priorityDate | 2015-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.