| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19b5c6093f8859d3e6bf9237df2eb5b |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_206e264be9a2d54b3096dd493bdb89e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55b712e478693cfd32dee0492cded009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e4a1bd15e426cd0566691f47a400d01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e08731cee5dca726bb7152c3c7b421f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61b56fa39f9e5bda14df408ec27a07e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3b060a10c591367b8547cd73b851831 |
| publicationDate |
2016-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016119424-A |
| titleOfInvention |
Printed wiring board substrate, printed wiring board, and printed wiring board manufacturing method |
| abstract |
An object of the present invention is to provide an inexpensive printed wiring board substrate including a metal layer having high peel strength. A printed wiring board substrate according to an embodiment of the present invention includes an insulating base film and a metal layer laminated on at least one surface side of the base film. And having a dispersed portion in which palladium is dispersed in the base film. Palladium is preferably present in the dispersed portion so that the content is 1% by mass or more as determined by EDX. It is preferable that the dispersed portion includes a region having an average of 500 nm or more from the interface with the metal layer. The palladium content of the A layer of 1 μm or less in the thickness direction from the interface with the metal layer in the base film is larger than the palladium content of the B layer of 500 nm or less in the thickness direction from the interface with the base film in the metal layer. Good. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023189745-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019061898-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020004624-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7070947-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11570899-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7215478-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020004624-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6996193-B2 |
| priorityDate |
2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |