| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a4504c144bd3ee715e13d3af7c674f26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f90b760c9aaf1f54af2e726732f3df19 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0542
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C1-16 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c366966a584de939b9c1478d713536c |
| publicationDate |
2004-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004056162-A1 |
| titleOfInvention |
Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package |
| abstract |
A method for producing a flip-chip mounting electronic component having a plurality of terminals (3) spotted on the mounting face (1) with a conductor being formed on the terminal (3) in which flip-chip mounting capable of shortening the distance between bumps (7) is realized. A step for covering the mounting face (1) with a conductor of specified thickness, a step for masking the conductor surface at such parts as corresponding to the terminal (3) parts, and a step for removing the conductor except the mask (6) part are carried out in this order. The bump is preferably composed of copper. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010067610-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017069283-A |
| priorityDate |
2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |