| abstract |
The present invention provides a good sensitivity, adhesion, line width reproducibility, and resolution when developing after heating after exposure, especially when the time from exposure to development is long. Adhesive photosensitive resin composition. One aspect of the present invention provides a photosensitive resin composition comprising (A) an alkali-soluble polymer: 10% by mass to 90% by mass; (B) a compound having an ethylenically unsaturated double bond: 5% by mass to 70% by mass; (C) Photopolymerization initiator: 0.01% by mass to 20% by mass; and (D) Phenolic polymerization inhibitor: 1 ppm to 300 ppm, and at least one of 375 nm and 405 nm The light transmittance is 58% to 95%. |