http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112987496-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2020-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63d5f4b415127170931c6380d537993c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b662ff54e77f61e46945d9599043035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49c8324597b229421eec6e10cce607de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a2e9ef4fe7d19c108eec87c91bdd5c6 |
| publicationDate | 2021-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112987496-A |
| titleOfInvention | Photosensitive resin composition, transfer film using photosensitive resin composition |
| abstract | A photosensitive resin composition and a transfer film using the photosensitive resin composition. To provide a dry film resist for improving the yield of objects and patterns formed by photolithography, or a pattern forming method including the same, and the improvement of lamination properties, minimum development time, resolution, undercut amount, Cu defects and development residues At least one of the photosensitive resin laminates is excellent. Provided is a dry film resist comprising a support film and a photosensitive resin composition layer on the support film, the photosensitive resin composition including (A) an alkali-soluble resin, (B) a photopolymerizable compound including an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) a dye, the maximum point load in a specific puncture test is 70 gf or more; as the B component, a trifunctional or more multifunctional monomer and a difunctional monomer are included; and/or the photosensitivity The acid value of the nonvolatile matter of the resin composition is represented by A, the thickness of the photosensitive resin composition layer is represented by T, and the ratio of the acid value A to the thickness T is 5 to 90. |
| priorityDate | 2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 289.