http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05251852-A

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filingDate 1992-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4ed965d0395204be581dd7e378a6729
publicationDate 1993-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05251852-A
titleOfInvention Wiring board and manufacturing method thereof
abstract (57) [Abstract] [Purpose] To provide a wiring board and a manufacturing method thereof capable of forming high-density, high-section wiring at low cost without going through complicated steps. [Structure] A plating portion 3 which is thicker in the thickness direction than in the width direction is attached to the periphery of a wiring 2 having a mountain-shaped or substantially I-shaped cross-section having a sufficiently cut middle portion. The wiring 2 is formed by over-etching, and in the subsequent electrolytic plating, the plated portion is grown in the thickness direction rather than the width direction by utilizing the fact that the metal ion concentration between adjacent wirings is relatively low. As a result, high-density and high-section wiring can be obtained.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113302331-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113302331-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016147993-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10111330-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014027251-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016009854-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015199116-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170924-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019530219-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015228479-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150134858-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106664800-A
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Total number of triples: 35.