http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201922815-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 |
| filingDate | 2018-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b89d830ab5128f7706f85157699ac6c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7bc6852c8a3777d80bfd006e6166315 |
| publicationDate | 2019-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201922815-A |
| titleOfInvention | Method for manufacturing circuit wiring, method for manufacturing touch panel, and method for manufacturing patterned substrate |
| abstract | An embodiment of the present invention provides a method for manufacturing a circuit wiring and a method for manufacturing a patterned base material. The method for manufacturing a circuit wiring includes: using a photosensitive transfer material having a temporary support and a photosensitive resin layer to make the photosensitive The step of bonding the photosensitive resin layer of the transfer material to the substrate with the conductive layer in contact with the substrate; the step of peeling the temporary support from the photosensitive resin layer bonded in the step of bonding; the mask and the The steps of contacting the photosensitive resin layer after peeling the temporary support and pattern-exposing the photosensitive resin layer; developing the pattern of the photosensitive resin layer after the pattern exposure to form a pattern; and forming a pattern on the photosensitive resin layer The step of etching the exposed conductive layer in the patterned area. The surface of the photomask used in the patterned exposure step in contact with the photosensitive resin layer has a protective layer. The protective layer is contained at 25 ° C and 1 atmosphere. Are solid particles. |
| priorityDate | 2017-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 215.