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filingDate 2022-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022344456-A1
titleOfInvention Metal Substrate Structure for a Semiconductor Power Module
abstract A method can be used for manufacturing a metal substrate structure for a semiconductor power module. A plurality of terminals are welded to a metal top layer. After the welding, a dielectric layer is coupled between the metal top layer and a metal bottom layer. The dielectric can be laminated or molded, as examples.
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