http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201922817-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-281 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b89d830ab5128f7706f85157699ac6c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7bc6852c8a3777d80bfd006e6166315 |
| publicationDate | 2019-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201922817-A |
| titleOfInvention | Circuit wiring manufacturing method and touch panel manufacturing method |
| abstract | A method for manufacturing a circuit wiring and a method for manufacturing a touch panel, comprising: using a photosensitive resin as a reference with a temporary support of a positive photosensitive transfer material having a temporary support and a photosensitive resin layer with respect to a substrate; A step of contacting and bonding the outermost layer on the layer side with the substrate; a step of patterning the photosensitive resin layer after the bonding step; and bonding the photosensitive resin layer and the substrate after the pattern exposure step The combined structure is heated so that the temperature of the structure becomes a temperature of -30 ° C to + 10 ° C relative to the glass transition temperature of the resin component contained in the photosensitive resin layer, and exceeds 20 A step of temperature; a step of developing a pattern on the photosensitive resin layer after the step of heating to form a pattern; and a step of etching the substrate in a region where the pattern is not arranged. |
| priorityDate | 2017-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 181.