http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101761943-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2012-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101761943-B1 |
| titleOfInvention | Method for removing seed layer in printed circuit board manufacturing process and printed circuit board manufactured by using the method |
| abstract | The present invention relates to a method of removing a seed layer in the manufacture of a printed circuit board. A method for removing a seed layer in the production of a printed circuit board according to the present invention includes the steps of: forming a photoresist layer on a printed circuit board on which a seed layer is formed; Removing the photoresist layer in a predetermined pattern; Forming a plating layer for a circuit on a predetermined pattern from which the photoresist layer is removed; Removing the photoresist layer around the plating layer to expose the seed layer; Forming a corrosion layer on the seed layer and the surface of the plating layer by chemically reacting the substrate on which the seed layer is exposed in a reactor filled with a predetermined gas; And removing the seed layer by removing the corrosion layer by irradiating a laser to the corrosion layer. According to the present invention, in removing the copper seed layer, a laser ablation as a dry etching method is employed instead of the conventional wet etching method, but a chemical reaction by chlorine gas is caused to cause a chloride corrosion layer By performing laser ablation after formation, a precise wiring pattern can be obtained even with a low energy supply, and damage of the copper plating layer can be prevented. |
| priorityDate | 2012-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.