Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4903b7b4b84e3b845aef791cad8f2e97 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P40-57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10378 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-352 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-0025 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K103-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-352 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-0622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00 |
filingDate |
2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45a5b1ab03a89a9c4173edb2316ce74c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8b63a341f5a7886043cab0ca2c9e32a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6da49500221f1e9dffdd71951c333a2c |
publicationDate |
2019-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10276368-B2 |
titleOfInvention |
Method for producing glass substrate with through glass vias and glass substrate |
abstract |
A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate. |
priorityDate |
2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |