http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101910943-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32ce12f8709350afe097badddf523729 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2008-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5756c354d77ef11b59d84819020ccd6b |
| publicationDate | 2015-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101910943-B |
| titleOfInvention | Photosensitive resin laminate |
| abstract | The present invention provides a photosensitive resin laminate in which even when the thickness of the photosensitive resin layer is as thin as 3 to 15 μm, the hole-clogging properties are good even when exposed by direct drawing exposure, and the aggregates during development are not oily of. The photosensitive resin laminate is formed by laminating at least a support layer and a photosensitive resin layer, and the photosensitive resin layer uses a photosensitive resin laminate formed of a photosensitive resin composition, the photosensitive resin composition It is characterized in that it includes at least: (a) 25-64% by mass of an alkali-soluble resin, (b) a photopolymerizable compound having an unsaturated double bond, (c) 0.1-20% by mass of a photopolymerization initiator, and further Satisfy the following (i), (ii) and (iii): (i) relative to the total amount of the photosensitive resin composition, containing 30 to 55% by mass of a specific photopolymerizable unsaturated compound; (ii) the (a) The weight-average molecular weight of the alkali-soluble resin is 70000-220000, and the acid equivalent is 100-600; (iii) The thickness of the photosensitive resin layer is 3-15 μm. |
| priorityDate | 2007-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.