| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0761
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate |
2008-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_774f55e385f774f7553647fc16727c15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44cbbedbc5c4769cb856c5f940706080
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de72a16f6309c0806eb2267f638a201d |
| publicationDate |
2010-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-101690429-A |
| titleOfInvention |
Process for producing printed wiring board and printed wiring board produced by the production process |
| abstract |
The object of the invention is to provide a process for producing a printed wiring board, which can remove a residual metal among wirings at a low cost in a simple process without side etching of a copper layer and can realize satisfactory insulation reliability even in the case of a micro wiring product, and a printed wiring board produced by the production process. A process for producing a printed wiring board, comprising the step of forming a pattern by etching of a two-layer flexible substrate comprising an insulator film, a substrate metal layer provided directly on at least one side ofthe insulator film without through anyadhesive and a copper film layer provided on the substrate metal layer, characterized in that the etching is carried out by a method comprising the step of etching the two-layer flexible substrate by a ferric chloride solution or a hydrochloric acid-containing cupric chloride solution, and the step of then treating the two-layer flexible substrate with an acidic oxidizing agent containing a permanganate and acetic acid. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114293056-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114293056-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102812786-A |
| priorityDate |
2007-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |