http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110113877-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3be6d14939f7c35306c28429717c1aa8 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2019-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2c5ea90af9cddec808f0bf45360a066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46bf5e1c5963b360e854ae7a8bc8c0f7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7d4ed69aaae42d8cbcebcdebc400005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acb0f4680cf20a4d083349a5efd32886 |
| publicationDate | 2019-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110113877-A |
| titleOfInvention | A method of manufacturing metal base circuit board by laser cutting method |
| abstract | The embodiment of the invention discloses a method for manufacturing a metal base circuit board by a laser cutting method, which relates to the technical field of circuit board manufacturing. This technical scheme takes metal-based circuit boards as the research object (including: metal-based single-sided boards, metal-based single-sided multi-layer boards), and the copper substrates are laser-cut and vacuum screen-printed resin to fill the cutting gaps to create areas that are independent and insulated from each other. Then make a copper boss on this area. After the copper boss is browned, it is pressed with the window RCC to form a copper-based single panel, and then the circuit board is made according to the normal process. After the design is electroplated, the copper bosses are reconnected and conductive. When the outer layer is etched, the electroplated copper needs to be etched away, so that the copper bosses are independently insulated, and finally a micro-pitch, high heat dissipation, and multi-network design are realized. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111225508-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111225508-A |
| priorityDate | 2019-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.