abstract |
The photosensitive resin composition of the present invention is characterized in that it is a copper-clad laminated board containing an alkali-soluble polymer, a compound having an ethylenic double bond, and a photopolymerization initiator, and a copper foil having a thickness of 18 μm is laminated on it The photosensitive resin layer containing the above-mentioned photosensitive resin composition with a thickness of 25 μm on the upper layer was subjected to patterned light irradiation and development treatment with a line / gap = 50 μm / 30 μm to form a hardened resist pattern, and the test was performed at 50 ° C After 55 seconds of copper etch treatment, the hardened resist pattern was removed, and the bottom width of the obtained copper wire pattern was 38 μm or more. |