| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6038f17109882ad88e9ba8ea907ebb45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-34 |
| filingDate |
2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99ed4a89e54ad61844e97cf84e3f1f97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_725b00f257c2761e9cd849016367c53f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af7a8af9ba110c2bc6dd4d4fd1d39ebb |
| publicationDate |
2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9441303-B2 |
| titleOfInvention |
Microetching solution for copper, replenishment solution therefor and method for production of wiring board |
| abstract |
Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount. |
| priorityDate |
2012-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |