| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0574
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 |
| filingDate |
2010-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3554c59fc6261c120d862003d367d297
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca2a3606c27054d6e84b501370e9e7df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03558d0e944bf8608aa03f1ba7c7c94d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b92bb5205d7921c01744ad2081d9c215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3438d8b4270838569ec3d81cfd676e1 |
| publicationDate |
2011-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201109672-A |
| titleOfInvention |
Thin-film probe sheet and method of manufacturing the same, probe card, and semiconductor chip inspection apparatus |
| abstract |
A semiconductor chip inspection apparatus largely reduces occurrence of damage due to foreign matter in an inspection process and improves durability at the same time of miniaturization is provided. As to a highly accurate thin-film probe sheet which performs: a contact to electrode pads arranged at a narrow pitch and a high density along with integration of semiconductor chip; and an inspection of semiconductor chips, by providing two layers of metal films selectively removable in a step-like shape in a periphery region of fine contact terminal having sharp tips and arranged at a high density and a narrow pitch at the same level as electrode pads, an upper periphery of the contact terminals is covered with an insulating film, and a large space region is formed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I795731-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11561242-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103134960-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I461696-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103134960-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I626448-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I601959-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11782072-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111566790-A |
| priorityDate |
2009-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |