http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109315070-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2017-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_055732915e1e00d400adce84a0173adf |
| publicationDate | 2019-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109315070-A |
| titleOfInvention | Manufacturing method of multilayer substrate |
| abstract | The manufacturing method of a multilayer substrate includes a preparation process, a filling process, and 1st, 2nd, and 3rd formation processes. The preparation step prepares an insulating base material (12) having a conductor pattern (18) formed on one side thereof. At this time, the conductor pattern (18) is made of Cu element. In addition, a Ni layer (16) is formed on the surface of the conductor pattern (18) on the side of the insulating base material (12). In the first forming step, a via hole (20) having a conductor pattern (18) as a bottom (20a) is formed in the insulating base material (12). At this time, the Ni layer ( 16 ) located in the range to be the bottom ( 20 a ) is removed. The filling step fills the conductive paste (22) into the inside of the via hole (20). In the second forming step, a laminate (24) is formed by stacking a plurality of insulating base materials (12). In the third forming step, the laminated body (24) is heated while being pressurized. Thereby, in the manufacturing method of a multilayer substrate, a plurality of insulating base materials (12) are integrated to form conductive holes (26). At this time, a diffusion layer (24) containing the metal element and the Cu element in the conductive paste (22) is formed between the conductive pattern (28) and the conductive hole (26). |
| priorityDate | 2016-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.