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filingDate 2008-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2008140016-A1
titleOfInvention Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
abstract A photosensitive resin composition comprising (A) an acid-modified vinyl-containing epoxy resin, (B) a photopolymerization initiator containing a compound having an oxime ester bond and (C) a sensitizer containing any of coumarin compounds of the following general formula (1).
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10111328-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011043565-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014136897-A1
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