| abstract |
A kind of circuit device and its manufacturing method are disclosed in the present invention. After isolation trenches 54 are formed at a conducting foil 60, circuit elements are mounted; and insulating resin 50 is stuck on the conducting foil 60, which is used as the retaining substrate. After inversion, the conducting foil is polished and isolated as the conducting paths by using the insulating resin 50 as the retaining substrate. As a result, a circuit device wherein the conducting paths 51 and the circuit elements 52 are retained by the insulating resin 50 can be realized without adopting the retaining substrate. Furthermore, through L1, L2 L3, the leaf-shaped wiring pair required for forming circuit is formed; and through the bending structure 59 or the protruding sheet 58, falling can be prevented. |