http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017090386-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2016-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2017090386-A1 |
| titleOfInvention | Manufacturing method of resin laminate with wiring pattern |
| abstract | The manufacturing method of the resin laminated body with a wiring pattern of this invention is the copper layer on the surface of this copper layer in the laminated body of the resin layer (1, 11) containing a polyvinyl acetal resin, and a copper layer (2, 12). A step of providing an etching resist layer (3) or a wiring pattern layer (14) so that the exposed first opening (8, 18) is formed; and an etching ability of the copper layer exposed in the first opening to copper. And a step of exposing the surface of the resin layer on the copper layer side by removing using an etching solution that is substantially free of chlorine. |
| priorityDate | 2015-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.