| abstract |
Provided is a photosensitive resin composition having excellent sensitivity, adhesiveness, line-width reproducibility and resolution when heated after exposure, and then developed. In particular, this composition exhibits excellent adhesiveness even if the length of time between exposure and development is long. According to one embodiment, the photosensitive resin composition includes: (A) an alkali-soluble polymer: 10 to 90 mass%; (B) a compound having an ethylenic unsaturated double bond: 5 to 70 mass%; (C) a photo polymerization initiator: 0.01 to 20 mass%; and (D) a phenolic polymerization inhibitor: 1 to 300 ppm. The light transmittance at 375 nm and/or 405 nm is 58 to 95%. |