| abstract |
An electronic device having a coreless type structure that is advantageous for thinning and miniaturization but having a structure that is difficult to crack in the manufacturing process and that is advantageous for external mounting, a method for manufacturing the electronic device, and the electronic device Provided are a substrate for an electronic device and a method for manufacturing the same. A PSR film having a plurality of openings, an electronic component 21 mounted at a predetermined position on the PSR film, and an electronic component 21 and a second plating film 7 filled in the opening are connected. Bonding wire 22, sealing resin 23 formed so as to cover them, protruding terminal 24 provided in contact with first plating film 6 on the back side of the PSR film, and surface of protruding terminal 24 The electronic device 20 is provided with the surface treatment layer 25 formed on the surface. [Selection] Figure 3 |