| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12993
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12479
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12514
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate |
2001-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7302a91c425477bb0f41030355dfdcc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17598a359ae35e21b92a683fe6bf8ca5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73c3ffbae94d73653068ad72a066aee6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4df3cc684b48f564dcc49aa11272b16 |
| publicationDate |
2003-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6579591-B2 |
| titleOfInvention |
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
| abstract |
This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006049058-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7151049-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004253804-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011097597-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100497751-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9175400-B2 |
| priorityDate |
1997-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |