| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7442b6cce4e96d3dc4a380851e9224d8 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2005-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e05d4ae37247a74985e2c34fd4086cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8553cd3c165d47c9dc9c6751ad774eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_300c1ada3be96568c77334c61ca9cd9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9419cd5260130b57f6845ead0567ef79 |
| publicationDate |
2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2006049058-A1 |
| titleOfInvention |
Method for the electrolytic deposition of metals |
| abstract |
The present invention relates to a method as well as and electrolyte for the electrolytic deposition of mat or half-glossy copper layers from an acid electrolyte in a pull-through device. The method according to the invention is operated with current densities comprises between 10 and 100 A/dm2 and is suitable for depositing sufficiently thick copper layers in high-speed pull-through devices. The electrolyte according to the invention comprises apart from copper, alkyl sulfonic acid. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019122788-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009038949-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7857960-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9493886-B2 |
| priorityDate |
2004-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |