| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2bce14ef8539c6ebccec6e11fb0b9014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bb554d7b3781b82950f635e0fab5897b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_850a426ff6d6a15e9ad3cc21d1f44b56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 |
| filingDate |
2012-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b3581bb42dcbc39504a62111d9db905
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b54ea2be3b52d7c5cf15fecbd6e1cf02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40dbdf44b6ed3901c001d70cf96a3a2f |
| publicationDate |
2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9493886-B2 |
| titleOfInvention |
Low internal stress copper electroplating method |
| abstract |
Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit. |
| priorityDate |
2011-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |