http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I711127-B

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filingDate 2017-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53da73fd37dcbfb93d50205ffb8e67c2
publicationDate 2020-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I711127-B
titleOfInvention Copper foil with carrier and its manufacturing method, and manufacturing method of coreless support with wiring layer and printed wiring board
abstract The present invention provides a copper foil with a carrier. When the wiring layer on the surface of the coreless support is formed, the anti-reflective layer exhibits excellent chemical resistance to the copper flash etching solution, and has excellent chemical resistance to the copper flash etching solution. When the image is inspected after etching, the contrast with the anti-reflection layer can bring excellent recognizability of the wiring layer. The copper foil with a carrier includes: a carrier, a peeling layer, an anti-reflection layer, and an ultra-thin copper layer. The peeling layer is provided on the carrier; the anti-reflection layer is provided on the peeling layer and is made of Cr It is composed of at least one metal selected from the group consisting of, W, Ta, Ti, Ni and Mo; the ultra-thin copper layer is arranged on the anti-reflection layer, and the surface of the anti-reflection layer at least the ultra-thin copper layer side It is an aggregate of metal particles.
priorityDate 2016-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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