| abstract |
(A) Alkali-soluble resin, (B) photoinitiator, and (C) acrylate monomer may be included, (D) methacrylate monomer may further be included, and said (C) acrylate monomer is (C1) double An acrylate monomer having a bonding equivalent of 250 or more and an acrylate monomer having a (C2) double bond equivalent of 150 or less, wherein the content of the (D) methacrylate monomer is 0 to 5% by mass with respect to the (C) acrylate monomer. Content of the acrylate monomer of 250 or more of (C1) double bond equivalents is 40-60 mass%, content of the acrylate monomer of (C2) double bond equivalent 150 or less is 40-60 mass%, with respect to the photosensitive resin composition, The photosensitive resin composition whose content of the said (B) photoinitiator is 0.5-1.5 mass%, and the etching method and plating method using the said photosensitive resin composition. |