| abstract |
[PROBLEMS] To provide excellent adhesion to a metal substrate even when a baking process is performed after forming a resist pattern. As a result, there is little infiltration of an etching solution into the surface of the metal substrate, and solubility in a resist stripping solution. In addition, the present invention provides a photosensitive resin composition for chemical milling in which the resist does not break even when it is baked. The photosensitive resin composition for chemical milling contains at least (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) an acrylate monomer, and (D) with respect to (C) the acrylate monomer. The content of the methacrylate monomer is 0 to 5% by mass, the content of the acrylate monomer having a double bond equivalent of 250 or more is 70% by mass or more, and the content of the acrylate monomer having a double bond equivalent of 150 or less is 30% by mass. The photosensitive film which provided the photosensitive resin layer formed from the photosensitive resin composition for chemical milling characterized by the following, and this photosensitive resin composition on the carrier film. [Selection figure] None |