| abstract |
Resist peeling is easy even in a narrow-pitch resist pattern, and in the pattern formation or plating process, fine lines and dots are stably maintained on the substrate, and a photosensitive resin composition having high resolution and the photosensitive resin composition are used. Making it a subject to provide a plating method, (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer, and (C) an acrylate monomer, (D) a methacrylate monomer A compound having a content of 0 to 5% by mass, (C) as an acrylate monomer (C1) ethylene oxide-modified pentaerythritol tetraacrylate (represented by the general formula (i), l + m + n + o = 24 to 48) ), and (C) with respect to the total amount of the photosensitive resin composition having a content of (C1) of 30 to 70% by mass, and a plating method using the photosensitive resin composition and a method for producing a metal pattern, the above problem was solved. . |