| abstract |
A photosensitive resin composition containing an alkali-soluble polymer, a compound having an ethylenic double bond, and a photopolymerization initiator, wherein the photosensitive resin composition is characterized in that: a photosensitive resin layer comprising the photosensitive resin composition is laminated to a thickness of 25 μm onto a copper-clad laminated plate laminated with 18-μm-thick copper foil; a cured resist pattern is formed through light irradiation in a pattern where the line/space ratio is 50 μm/30 μm and a development treatment; and a copper etching process is performed for 55 seconds at 50℃, whereupon the bottom width of the copper line pattern obtained by removing the cured resist pattern is 38 μm or greater. |