http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018179640-A1
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
filingDate | 2017-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2019-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2018179640-A1 |
titleOfInvention | Photosensitive transfer material and circuit wiring manufacturing method |
abstract | The photosensitive transfer material has a temporary support, an intermediate layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer has an acid group protected with an acid-decomposable group. A structural unit containing a polymer having a structural unit and a photoacid generator, wherein the intermediate layer is water-soluble or alkali-soluble and has a phenolic hydroxyl group or an alcoholic hydroxyl group not directly bonded to the main chain. Contains resin C. In addition, a method for manufacturing circuit wiring using the photosensitive transfer material is provided. |
priorityDate | 2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 212.