| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
| filingDate |
2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14a279f01565268df89d7782f63ffeff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0502195b3ce551cb9a304476824d2570 |
| publicationDate |
2021-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112368642-A |
| titleOfInvention |
Photosensitive resin composition and method for forming resist pattern |
| abstract |
To provide a photosensitive resin composition suitable for realizing higher resolution by heating after exposure. A photosensitive resin composition for heating after exposure, and then developing a photosensitive resin composition to obtain a resin cured product, comprising the following in terms of the total solid content mass of the photosensitive resin composition Components: (A) alkali-soluble polymer: 10% by mass to 90% by mass; (B) compound having an ethylenically unsaturated double bond: 5% by mass to 70% by mass; and (C) photopolymerization initiator: 0.01% by mass %-20 mass %, (A) the structural unit of styrene and/or styrene derivative in the whole alkali-soluble polymer is 15 mass % or more. |
| priorityDate |
2018-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |