| abstract |
Provided are a copper foil and a copper-clad laminate, which have good circuit processability and can suppress transmission loss even when used for a high-frequency circuit board. The surface on the glossy surface side of the copper foil has a surface roughness Ra measured by a laser microscope of 0.25 μm or less, and a surface roughness Rz measured by a laser microscope of 1.10 μm or less. A copper foil having a layered structure after being heated at 200 ° C. for 30 minutes, after being heated at 130 ° C. for 30 minutes, or after being heated at 300 ° C. for 30 minutes. [Selection] Figure 1 |