http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102340959-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-02 |
| filingDate | 2018-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102340959-B1 |
| titleOfInvention | Etching liquid for resin composition and etching method |
| abstract | In the process of removing the resin composition containing the alkali-insoluble resin and the inorganic filler, there is no occurrence of defects due to excessive heat generation of the resin composition layer containing the resin composition, and the etchant or etching solution capable of removing only the resin composition layer It is an object of the present invention to provide a method. The etching liquid for resin compositions containing alkali-insoluble resin and 50-80 mass % inorganic filler WHEREIN: The etching liquid contains 15-45 mass % alkali metal hydroxide, More preferably, 5-40 mass % further Etching liquid containing an ethanolamine compound in mass %. Moreover, the etching method which removes the resin composition containing alkali-insoluble resin and an inorganic filler using this etching liquid. |
| priorityDate | 2017-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.