http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113573486-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2021-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113573486-B |
| titleOfInvention | RF-IC carrier plate manufacturing device and manufacturing method |
| abstract | The invention discloses a device and a method for manufacturing an RF-IC (radio frequency-integrated circuit) support plate, belonging to the technical field of RF-IC support plate manufacturing processes, wherein the device for manufacturing the RF-IC support plate comprises a BT (BT) plate module, the output end of the BT plate module is provided with a copper reduction browning module, the output end of the copper reduction browning module is provided with a through laser module, the output end of the through laser module is provided with a copper deposition module, and the method for manufacturing the RF-IC support plate comprises the following main steps: subtract copper brown ization, to wearing radium-shine, heavy copper, circuit, graphic plating, the membrane of moving back, flash etching, AOI, hinder and weld, nickel palladium gold, shaping and electricity and survey, through setting up brand-new MSAP technology preparation circuit for the quality of the BT board of making is higher, satisfies customer's demand more easily, through setting up radium-shine, electroplate and hinder and weld dry film technology, has broken through current production technology, has improved the efficiency of BT board whole production greatly, makes production efficiency obtain effectual improvement. |
| priorityDate | 2021-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.