http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201348887-A

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filingDate 2013-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9858c9abb6c7bc96f50a334eaa5569ca
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publicationDate 2013-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201348887-A
titleOfInvention Resist adhesion improver and copper wiring manufacturing method
abstract The present invention relates to a resist adhesion improving agent comprising 1.5 to 20% by weight of an organic acid, 0.0007 to 0.73% by weight of a chloride ion, 0.00003 to 3.7% by weight of an ammonium ion, and the remainder of the water, and the chloride ion is relatively a molar concentration ratio of ammonium ions in the range of 0.1 to 10; and a copper wiring manufacturing method for using a resist adhesion enhancer to a copper film when a photosensitive resist film is formed on a copper film After the surface is treated, a photosensitive resist film is formed on the copper film. Thereby, the adhesion of the photosensitive resist to the surface of the copper film is improved.
priorityDate 2012-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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