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filingDate 2004-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd3e4d4c821071b77759bc69cb1e3009
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publicationDate 2006-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20060055547-A
titleOfInvention Method for forming photosensitive element, resist pattern, and method for manufacturing printed wiring board
abstract In particular, it aims at providing the photosensitive element which is excellent in the sensitivity and the resolution with respect to the exposure by the light of wavelength 400-450 nm, and whose cross-sectional shape of the resist after development is rectangular, the formation method of a resist pattern, and the manufacturing method of a printed wiring board.n n n This invention is a photosensitive element provided with a support body and the photosensitive resin composition layer comprised from the photosensitive resin composition containing (A) binder polymer, (B) photopolymerizable compound, and (C) photoinitiator,n n n The photosensitive resin composition contains the thioxanthone type compound represented by following formula (I) as (C) component,n n n R which is the product of P and Q when P is the weight part of the thioxanthone compound and the film thickness of the photosensitive resin composition layer is Q [μm] with respect to 100 parts by weight of the total amount of the component (A) and the component (B), The condition of (1) is satisfied. In following formula (I), R < 1> -R < 8> represents a hydrogen atom, a halogen atom, or a hydrocarbon group.n n n 25.5 ≤ R ≤ 79.0 (1)
priorityDate 2003-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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