| abstract |
A description is given of a method of copper plating an electrically insulating plate (1), for example, of glass having a large number of holes (3). Said holes are internally provided with a copper layer (5') and the plate is provided with metal tracks (5''). The copper surface is provided with a corrosion-resistant layer (23, 25) of nickel-phosphor. To this end, first a layer (7', 7'') of nickel-boron is deposited on the copper surface which does not have to be activated. The method can very suitably be used for the manufacture of selection plates for thin electron displays. |