http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101929956-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_141c5c360293741c99739d24caf4235c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0766 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2018-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7543925a5a8b80b0cf578c532fcccf0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b550f0a56199ffeebda18fbc46e2e7dd |
| publicationDate | 2018-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101929956-B1 |
| titleOfInvention | Manufacturing method of printed circuit board of heater for electric vehicle |
| abstract | The present invention provides a printed circuit board with a heat generation rate higher than that of the printed circuit board itself, so that the printed circuit board itself is opened without applying solder resist ink, And an object of the present invention is to provide a method of manufacturing a heater printed circuit board for an electric automobile which improves reliability and durability by preventing damage. In order to achieve the above object, a method of manufacturing a heater printed circuit board for an electric vehicle according to the present invention comprises a first step (S100) of preparing an epoxy layer (100) in which first copper foils (110) A second step S200 of forming a predetermined inner layer circuit by performing an inner layer image process on the first copper foil 110 and a second step S200 of forming a predetermined circuit pattern on both sides of the epoxy layer 100, A first prepreg layer 200 having a second copper foil 210 and another surface laminated to contact the epoxy layer 100 and a predetermined circuit pattern and a second prepreg layer 200 formed on the other surface of the epoxy layer 100, A third step (S300) of forming a second prepreg layer (300) having a copper foil (310) on the other side and stacking the epoxy layer (100) and a predetermined circuit pattern; A fourth stage which forms the through hole A, the component hole B, the first mechanism hole C and the second mechanism hole D, An electroless copper plating layer 400 is formed on all areas except the inner wall of the second mechanism hole D and the second tool hole D. The electroless copper plating layer 400, A fifth step S500 of forming an electrolytic copper plating layer 500 on the first copper foil 500 and the second copper foil 210, the third copper foil 310, the electroless copper plating layer 400, A sixth step (S600) of forming a predetermined outer layer circuit including a heat radiation region (900) on one side of the second mechanism hole (D) by performing an outer layer image process on the plating layer (500) , The inner wall and the hole of the component hole (B), the inner wall and the hole of the first mechanism hole (C), the inner wall of the second mechanism hole (D) A seventh step S700 of printing the area of the solder resist ink 600 with the solder resist ink 600 and a step S700 of printing the area where the solder resist ink 600 is printed and the area excluding the inner wall of the second mechanism hole D The station, and a eighth step of forming a nickel plated layer 700 and a gold plated layer 800 in sequence (S800). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102155214-B1 |
| priorityDate | 2018-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.