http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100515490-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-05 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100515490-B1 |
| titleOfInvention | Method for Manufacturing a Flexible Printed Wiring Board, and a Flexible Printed Wiring Board Obtained through the Manufacturing Method |
| abstract | An object of the present invention is to provide a flexible printed wiring board having excellent migration resistance.n n n The present invention relates to a method of manufacturing a flexible printed wiring board by etching a copper clad laminate to a circuit, and after etching, (a) picking up the substrate on which the circuit etching is completed, A process for removing residual metal components in which metal components are removed from carboxyl metal salts remaining on a surface of a base resin exposed to a gap and converted into carboxyl groups. (b) heat-treating the substrate after the removal process of residual metal components for 10 minutes to 80 minutes under a high-temperature atmosphere of 180 ° C to 200 ° C to expose the surface of the polyimide resin film exposed to the gap between circuits formed on the substrate; The manufacturing method of the flexible printed wiring board characterized by including the re-ring-closure step of a ring-closing process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101002236-B1 |
| priorityDate | 2001-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.